Microscale Co., Ltd. has been established
in Feb. 2000 with a purpose of deploying its advanced flip chip bumping services
to the worldwide semiconductor industry

Microscale’s plant occupys a 4,950m2 area
with 1,650m2 of clean room (class100/10000) and has an output of 15,000 wafers
per month in 2001 and 50,000 wafers in 2003.

Starting with an Electro plating line for
Au bump, Microscale will set-up a stud bumping line, a solder bumping line,
and a PCB bumping line until 2001 to provide total bumping services to customers.

As a customer-driven business, Microscale
considers the customer’s satistaction as the most important thing and tries
to meet customer’s state-of-the-art needs by constant innovation and improvement
of flip chip technology. Our future- oriented technology, know-how and personal
commitment will meet the emerging needs for advanced packages